Microelectronic packages with embedded interposers

An electronic device comprising:

• multiple integrated circuit (IC) dice disposed on a package substrate, the package substrate having a substrate area;
• a mold layer that includes the IC dice and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer;
• and
• an interposer layer extending over the substrate area and including a stiffening material more rigid than a material of the package substrate, the interposer layer further including multiple electrically conductive through layer vias contacting the conductive pillars at the first surface of the mold layer and extending through the stiffening material to a second surface of the interposer layer,
• wherein the stiffening material is a metal more rigid than the package substrate, the interposer layer is a metal interposer layer, and the multiple through layer vias include an insulating dielectric material separating the metal of the metal interposer layer and the electrically conductive material of the through layer vias.

A packaged electronic system comprising:

• multiple integrated circuit (IC) dice disposed on a package substrate, the package substrate having a substrate area;
• a mold layer that includes the IC dice and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer;
• a glass interposer layer having substantially a same area as the substrate area and arranged above the mold layer, the glass interposer layer including multiple electrically conductive through glass vias (TGVs) in electrical contact with the conductive pillars and extending through a stiffening material of the glass interposer layer to a second surface of the interposer layer;
• an adhesive between the glass interposer layer and the mold layer, the adhesive touching the glass interposer layer;
• and
• an electronic device arranged between the mold layer and the glass interposer layer and in electrical contact with at least two IC dice of the multiple IC dice and in electrical contact with at least one TGV,
• wherein the glass interposer layer is embedded in a redistribution layer contacting the mold layer and including at least one electrically conductive interconnect layer in electrical contact with the TGVs.