Power electronics module

A power electronics module, comprising:

• a continuous direct bonded copper (DBC) printed circuit board having power semiconductors arranged on connecting regions of an uppermost layer of said DBC printed circuit board;
• and
• a lead frame arranged above the power semiconductors for three-dimensional power and control routing, wherein the lead frame comprises:
• a drain-source connection configured to be brought into electrical contact with a drain-source contact on the printed circuit board;
• a load-source connection opposite the drain-source connection via the power semiconductors, and which is formed from a plurality of subregions, each of which can be brought into electrical contact with one of the power semiconductors;
• and
• at least one gate-source terminal and at least one kelvin-source terminal;
• and
• a carrier element comprising an electrically insulating material on which conductor tracks are provided, wherein the carrier element is routed between the power semiconductors in a region between the load-source connection and the drain-source connection.