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US 12,598,998 B2Granted
Interposer having inductor coil pattern embedded in buffer layer and fabrication thereof
AssigneeUnited Microelectronics Corp.
InventorsDa-Jun Lin, Bin-Siang Tsai, Fu-Yu Tsai, Chung-Yi Chiu
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Abstract
An interposer includes a substrate having an inductor forming region thereon, a plurality of trenches within the inductor forming region in the substrate, a buffer layer lining interior surfaces of the plurality of trenches and forming air gaps within the plurality of trenches, and an inductor coil pattern embedded in the buffer layer within the inductor forming region.
Claims18
An interposer, comprising:
- a substrate having an inductor forming region thereon;
- a plurality of trenches within the inductor forming region in the substrate;
- a buffer layer lining interior surfaces of the plurality of trenches, wherein the buffer layer defines air gaps within the plurality of trenches;
- an inductor coil pattern embedded in the buffer layer within the inductor forming region;
- and
- a dielectric capping layer covering the inductor coil pattern and the buffer layer within the inductor forming region.
3 more elements
A method for forming an interposer, comprising:
- providing a substrate having an inductor forming region thereon;
- forming a plurality of trenches within the inductor forming region in the substrate;
- forming a buffer layer lining interior surfaces of the plurality of trenches and forming air gaps within the plurality of trenches;
- forming an inductor coil pattern embedded in the buffer layer within the inductor forming region;
- and
- forming a dielectric capping layer covering the inductor coil pattern and the buffer layer within the inductor forming region.
3 more elements
Dependencies are inferred from the claim text.