Inductor with integrated magnetics
AssigneeIntel Corporation
InventorsTelesphor Kamgaing, Aleksandar Aleksov, Veronica Strong, Neelam Prabhu Gaunkar, Brandon Rawlings, Georgios C. Dogiamis
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Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a magnetic ring is embedded in the substrate. In an embodiment, a loop is around the magnetic ring. In an embodiment, the loop is conductive and comprises a first via through the substrate, a second via through the substrate, and a trace over a surface of the substrate, where the trace electrically couples the first via to the second via.
Claims13
An electronic package, comprising:
- a substrate, wherein the substrate comprises glass;
- a magnetic loop embedded in the substrate, the magnetic loop comprising a first vertical portion laterally spaced apart from a second vertical portion;
- and
- a conductive loop around the magnetic loop, wherein the conductive loop comprises:
- a first via through the substrate;
- a second via through the substrate, wherein the first vertical portion and the second vertical portion of the magnetic loop are laterally between the second via and the first via;
- and
- a trace over a surface of the substrate, wherein the trace electrically couples the first via to the second via.
An electronic package, comprising:
- a substrate, wherein the substrate comprises glass;
- a blind trench into the substrate;
- a liner on a bottom surface and sidewall surfaces of the blind trench, wherein the liner is conductive;
- a magnetic material filling the blind trench, the magnetic material comprising a first vertical portion laterally spaced apart from a second vertical portion;
- a first trace over the magnetic material and contacting the liner;
- a second trace over the magnetic material and contacting the liner;
- and
- a first via through the substrate;
- a second via through the substrate, wherein one of the first trace or the second trace coupled the second via to the first via, and wherein the first vertical portion and the second vertical portion of the magnetic loop are laterally between the second via and the first via.
Dependencies are inferred from the claim text.