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US 12,598,996 B2Granted
Passive circuit on a back-end-of-line of a package
AssigneeIntel Corporation
InventorsQiang Yu, Georgios C. Dogiamis, Gwang-Soo Kim, Ibukunoluwa Momson, Ali Farid, Said Rami
Life of this patent
Estimating the term…
Abstract
Embodiments herein relate to systems, apparatuses, or processes directed to fabricating passive circuits on a surface of a BEOL of a package, for example on a C4 connection layer of the BEOL. In embodiments, the passive circuits may be fabricated using a standard bump process. Other embodiments may be described and/or claimed.
Claims30
A package comprising:
- a substrate;
- a dielectric layer on the substrate;
- a metal layer on the dielectric layer;
- a plurality of conductive interconnect features on or over the metal layer, wherein the plurality of conductive interconnect features have a height that is at least a first height from a surface of the metal layer;
- an electrically conductive feature on or over the metal layer, wherein a height of the electrically conductive feature from the surface of the metal layer is at or below a second height, the electrically conductive feature directly electrically coupled to one of the plurality of conductive interconnect features;
- and
- wherein the first height is greater than the second height.
4 more elements
A system comprising:
- a package that includes a first substrate with a BEOL on the first substrate, wherein a side of the BEOL includes a plurality of bumps, and wherein the plurality of bumps is at least a first height from a surface of the side of the BEOL;
- a passive circuit on the side of the BEOL, wherein a height of the passive circuit from the surface of the side of the BEOL is at or below a second height, and wherein the first height is greater than the second height, the passive circuit directly electrically coupled to one of the plurality of bumps;
- and
- a second substrate, wherein a side of the second substrate is coupled with the side of the BEOL using at least a portion of the plurality of bumps on the side of the BEOL.
1 more element
A method comprising:
- providing a package that includes a substrate and a BEOL coupled with the substrate;
- applying a plurality of bumps to a side of the BEOL wherein the applied plurality of bumps have a height that is at least a first height from a surface of the side of the substrate;
- and
- applying a passive circuit to the side of the BEOL, wherein a height of the passive circuit from the surface of the side of the substrate is at or below a second height, and wherein the first height is greater than the second height, the passive circuit directly electrically coupled to one of the plurality of bumps.
1 more element
A system comprising:
- a package that includes a first substrate with a BEOL on the first substrate, wherein a side of the BEOL includes a plurality of bumps, and wherein the plurality of bumps is at least a first height from a surface of the side of the BEOL;
- a passive circuit on the side of the BEOL, wherein a height of the passive circuit from the surface of the side of the BEOL is at or below a second height, and wherein the first height is greater than the second height;
- and
- a second substrate, wherein a side of the second substrate is coupled with the side of the BEOL using at least a portion of the plurality of bumps on the side of the BEOL, wherein the passive circuit is a first passive circuit;
- and further comprising a second passive circuit on the side of the second substrate.
2 more elements
A system comprising:
- a package that includes a first substrate with a BEOL on the first substrate, wherein a side of the BEOL includes a plurality of bumps, and wherein the plurality of bumps is at least a first height from a surface of the side of the BEOL;
- a passive circuit on the side of the BEOL, wherein a height of the passive circuit from the surface of the side of the BEOL is at or below a second height, and wherein the first height is greater than the second height;
- a second substrate, wherein a side of the second substrate is coupled with the side of the BEOL using at least a portion of the plurality of bumps on the side of the BEOL;
- and
- a mold at least partially surrounding the package, the second substrate, and the passive circuit.
2 more elements
A system comprising:
- a package that includes a first substrate with a BEOL on the first substrate, wherein a side of the BEOL includes a plurality of bumps, and wherein the plurality of bumps is at least a first height from a surface of the side of the BEOL;
- a passive circuit on the side of the BEOL, wherein a height of the passive circuit from the surface of the side of the BEOL is at or below a second height, and wherein the first height is greater than the second height;
- a second substrate, wherein a side of the second substrate is coupled with the side of the BEOL using at least a portion of the plurality of bumps on the side of the BEOL;
- and
- a third substrate, wherein a side of the third substrate is coupled with the side of the BEOL using at least a portion of the plurality of bumps on the side of the BEOL, wherein the passive circuit is at least partially between the second substrate and the third substrate with respect to the side of the BEOL.
2 more elements
Dependencies are inferred from the claim text.