Liquid circulating cooling package substrate and manufacturing method thereof

A manufacturing method for a liquid circulating cooling package substrate, comprising:

• (a) prefabricating a support frame, the support frame comprising a conducting column penetrating through the support frame in a height direction and at least one through cavity surrounded by the support frame;
• (b) mounting a device having an active face and a heat dissipation face in the through cavity, and applying a first dielectric layer on a first surface of the support frame such that the first dielectric layer completely fills a gap between the device and the support frame;
• (c) opening a hole in the first dielectric layer to form a first pattern, the first pattern comprising a cooling chamber exposing the heat dissipation face of the device, and filling the first pattern to form a first wiring layer and a metal heat dissipation layer on the heat dissipation face, wherein the metal heat dissipation layer completely covers the heat dissipation face and an inner side surface of the cooling chamber;
• (d) applying a second dielectric layer to a second surface of the support frame, opening a hole in the second dielectric layer to form a second pattern, the second pattern exposing a terminal on the active face of the device, and filling the second pattern to form a second wiring layer, wherein the first wiring layer and the second wiring layer are electrically connected via the conducting column;
• and
• (e) forming a support column on the metal heat dissipation layer on the heat dissipation face of the device, and applying a cooling cover on the support column, the cooling cover closing the cooling chamber along a periphery of the cooling chamber, wherein the cooling cover is formed with a liquid inlet and a liquid outlet, wherein the step (e) further comprises:
• (e1) filling the cooling chamber with a dielectric material to form a third dielectric layer;
• (e2) forming an opening by laser in the third dielectric layer to form a third pattern exposing the metal heat dissipation layer;
• (e3) electroplating to fill the third pattern to form the support column;
• and
• (e4) removing the third dielectric layer.