Chip package and manufacturing method thereof
AssigneeXintec Inc.
InventorsChing-Ting Peng, Sheng-Hsiang Fu, Hsin-Yi Chen
Life of this patent
Estimating the term…
Abstract
A chip package includes a semiconductor substrate, a conductive pad, an isolation layer, and a redistribution layer. The semiconductor substrate has a first surface, a second surface facing away from the first surface, a through hole through the first and second surfaces, and a recess in the first surface. The conductive pad is located on the second surface of the semiconductor substrate and in the through hole. The isolation layer is located on the second surface of the semiconductor substrate and surrounds the conductive pad. The redistribution layer is located on the first surface of the semiconductor substrate, and extends into the recess, and extends onto the conductive pad in the through hole.
Claims18
A chip package, comprising:
- a semiconductor substrate having a first surface, a second surface facing away from the first surface, a through hole through the first and second surfaces, and a recess in the first surface;
- a conductive pad located on the second surface of the semiconductor substrate and in the through hole;
- an isolation layer located on the second surface of the semiconductor substrate and surrounding the conductive pad;
- and
- a redistribution layer located on the first surface of the semiconductor substrate, wherein the redistribution layer is a single uninterrupted layer comprising copper, and uninterruptedly extends into the recess and onto the conductive pad in the through hole.
A manufacturing method of a chip package, comprising:
- bonding, by a temporary bonding layer, a semiconductor substrate to a carrier, wherein the semiconductor substrate has a first surface facing away from the carrier and a second surface facing the carrier, and a conductive pad and an isolation layer are disposed on the second surface of the semiconductor substrate;
- etching the semiconductor substrate such that the semiconductor substrate has a through hole through the first and second surfaces and a recess in the first surface, wherein the conductive pad is located in the through hole;
- forming a redistribution layer on the first surface of the semiconductor substrate, wherein the redistribution layer is a single uninterrupted layer comprising copper, and uninterruptedly extends into the recess and onto the conductive pad in the through hole;
- and
- removing the carrier.
Dependencies are inferred from the claim text.