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US 12,598,962 B2Granted
System and method for bonding transparent conductor substrates
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsJeremy Alfred Theil, Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr., Belgacem Haba, Rajesh Katkar
Life of this patent
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Abstract
An element includes a substrate and a surface layer on the substrate. The surface layer includes at least one first region comprising an optically transparent and electrically insulative first material and at least one second region at least partially embedded in the at least one first region. The at least one second region comprises an optically transparent and electrically conductive second material.
Claims17
An element comprising:
- a substrate;
- and
- a surface layer on the substrate, the surface layer comprising:
- at least one first region comprising an optically transparent and electrically insulative first material;
- and
- at least one second region at least partially embedded in the at least one first region, the at least one second region comprising an optically transparent and electrically conductive second material, wherein the second material is selected from the group consisting of:
- doped and undoped metal oxides, aluminum zinc oxide, indium tin oxide, zinc oxide, zinc tin oxide, indium-doped zinc oxide, indium oxide, cadmium tin oxide, tin oxide, titanium dioxide, niobium-doped titanium dioxide, and transition metal nitrides comprising a IIIB transition metal.
4 more elements
An apparatus comprising:
- a first substrate;
- a first layer on the first substrate, the first layer comprising:
- at least one first region comprising an optically transparent and electrically insulative first material;
- and
- at least one second region at least partially embedded in the at least one first region, the at least one second region comprising an optically transparent and electrically conductive second material;
- a second substrate;
- and
- a second layer on the second substrate, the second layer directly bonded to the first layer, the second layer comprising:
- at least one third region comprising an electrically insulative third material;
- and
- at least one fourth region at least partially embedded in the at least one third region, the at least one fourth region comprising an electrically conductive fourth material, the at least one second region and the at least one fourth region providing an electrically conductive and optically transparent connection between the first substrate and the second substrate.
8 more elements
An apparatus comprising:
- a first substrate;
- a first plurality of layers on the first substrate, the first plurality of layers comprising:
- at least one first layer comprising an optically transparent and electrically conductive first material;
- and
- at least one second layer over the at least one first layer, the at least one second layer comprising an optically transparent and electrically conductive second material comprising metal or polysilicon;
- a second substrate;
- and
- a second plurality of layers on the second substrate, the second plurality of layers comprising:
- at least one third layer comprising an optically transparent and electrically conductive third material;
- and
- at least one fourth layer over the at least one third layer, the at least one fourth layer comprising an optically transparent and electrically conductive fourth material comprising metal or polysilicon, the fourth material directly bonded to the second material.
8 more elements
Dependencies are inferred from the claim text.