Electronic structure and method of manufacturing the same

A method of manufacturing an electronic structure, the method comprising:

• preparing a substrate having a first surface;
• forming a support layer on the first surface of the substrate;
• forming a projection in the support layer on the first surface of the substrate;
• forming, on the support layer and the projection, a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface, the support layer having a third surface, the projection having a fourth surface, the second surface facing the third surface and the fourth surface;
• and
• removing at least part of the support layer,
• wherein the projection is formed such that an area of the fourth surface is smaller than an area of the second surface, and is formed by a material different from a material of the support layer.

An electronic structure, comprising:

• a substrate having a first surface;
• a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface;
• and
• a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit,
• wherein the projection has a third surface having an area smaller than an area of the second surface, the third surface being in contact with or positioned close to the functional element unit,
• wherein the protector of the functional element unit has a protector recess at the second surface at a position facing the projection in a thickness direction of the substrate, the protector recess being recessed in a direction away from the first surface from the second surface,
• wherein the third surface of the projection is located within the protector recess.

A method of manufacturing an electronic circuit, the method comprising:

• preparing an electronic structure, comprising:
• a substrate having a first surface;
• a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface;
• a support disposed between the first surface of the substrate and the second surface of the functional element unit, the support supporting the second surface of the functional element unit;
• and
• a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit,
• wherein the support has a third surface in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface,
• wherein the projection has a fourth surface in contact with or located close to the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support, and
• wherein the functional element unit is separable from the support and the projection,
• separating the functional element unit of the electronic structure from the support and the projection, and
• transferring the functional element unit to another substrate different from the substrate.