# US 12,598,951 B2 · Wafer placement table

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- Number: US 12,598,951 B2
- Document ID: US12598951B2
- Status: Granted
- Kind: B2
- Application number: 18/581,577
- Filed: 2024-02-20
- Published: 2024-12-12
- Granted: 2026-04-07
- Earliest claimed: 2023-06-07
- Assignees: NGK Insulators, Ltd.
- Applicants: Ngk Insulators, Ltd.
- Inventors: Taro Usami; Yohei Kajiura; Keita Ikegami
- Web page: https://patentgrep.com/patent/US12598951B2

## CPC

- H10P 72/722: {Details of electrostatic chucks}
- H10P 72/0434: {mainly by convection}
- H10P 72/72: using electrostatic chucks
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A wafer placement table includes: a ceramic plate having a wafer placement surface on its upper surface; a cooling plate provided on a lower surface of the ceramic plate; and a refrigerant flow path provided inside the cooling plate, wherein the refrigerant flow path includes a first portion and a second portion, the second portion continuing from the first portion and being divided into two or more ways forming branches that run side by side, and wherein the first portion has a cross-sectional area smaller than a sum of cross-sectional areas of the respective branches included in the second portion.

## Claims

### Claim 1

A wafer placement table comprising:
a ceramic plate having a wafer placement surface on an upper surface of the ceramic plate;
a cooling plate provided on a lower surface of the ceramic plate; and
a refrigerant flow path provided inside the cooling plate,
wherein the refrigerant flow path includes a first portion and a second portion, the second portion continuing from the first portion and being divided into two or more ways forming branches that run side by side, and
wherein the first portion has a cross-sectional area smaller than a sum of cross-sectional areas of the respective branches included in the second portion, and
wherein the refrigerant flow path includes a curved turn portion where the flow path is reversely directed, the refrigerant flow path being divided into two ways at a halfway position of the curve in the turn portion such that unevenness in an amount of refrigerant distribution between the branches in the second portion is reduced.

### Claim 2 (depends on 1)

The wafer placement table according to claim 1,
wherein the first portion is located in correspondence with an outer peripheral area of the wafer placement surface, and the second portion is located in correspondence with a central area of the wafer placement surface.

### Claim 3 (depends on 2)

The wafer placement table according to claim 2,
wherein the ceramic plate has an annular focus-ring placement surface provided around the wafer placement surface and located at a lower level than the wafer placement surface, the focus-ring placement surface being designed to receive an annular focus ring whose outside diameter is greater than an outside diameter of the ceramic plate and an outside diameter of the cooling plate.

### Claim 4 (depends on 1)

The wafer placement table according to claim 1,
wherein the cross-sectional areas of the respective branches in the second portion are each greater than ½ of the cross-sectional area of the first portion.

### Claim 5 (depends on 1)

The wafer placement table according to claim 1,
wherein the refrigerant flow path is curved preceding the division and divided into a branch that has a tendency continuing from a curve preceding the division, and a branch that temporarily deviates outward of the curve from the tendency of the preceding curve, and such that unevenness in an amount of refrigerant distribution between the branches in the second portion is reduced.

### Claim 6 (depends on 1)

The wafer placement table according to claim 1,
wherein, in plan view, a non-flow-path area that is defined as a size of an area where the refrigerant flow path is not provided is 50% or greater in an area over which the second portion spreads.

### Claim 7 (depends on 1)

The wafer placement table according to claim 1,
wherein the two or more ways forming branches are rejoined before reaching a refrigerant flow outlet.

### Claim 8 (depends on 1)

The wafer placement table according to claim 1,
wherein the second portion continuing from the first portion and being divided into two or more ways forming branches that run side by side are parallel to one another, and with the refrigerant flow path being in a same direction with respect to the two or more ways forming branches.

### Claim 9

A wafer placement table comprising:
a ceramic plate having a wafer placement surface on an upper surface of the ceramic plate;
a cooling plate provided on a lower surface of the ceramic plate; and
a refrigerant flow path provided inside the cooling plate,
wherein the refrigerant flow path includes a first portion and a second portion, the second portion continuing from the first portion and being divided into two or more ways forming branches that run side by side, and
wherein the first portion has a cross-sectional area smaller than a sum of cross-sectional areas of the respective branches included in the second portion, and
wherein the refrigerant flow path is curved preceding the division and divided into a branch that has a tendency continuing from a curve preceding the division, and a branch that temporarily deviates outward of the curve from the tendency of the preceding curve, and such that unevenness in an amount of refrigerant distribution between the branches in the second portion is reduced.