Substrate treating apparatus

A substrate treating apparatus for successively performing batch treatment for processing a plurality of substrates collectively and single-wafer treatment for processing the substrates one by one, the substrate treating apparatus comprising:

• a carrier mount shelf configured to place a carrier thereon, the carrier accommodating a plurality of substrates in a horizontal posture vertically at a predetermined gap;
• a transferring block adjoining the carrier mount shelf;
• and
• a treating block adjoining the transferring block,
• the transferring block including:
• a first posture turning mechanism configured to turn a posture of the substrates, taken out of the carrier, from horizontal to vertical;
• and
• a substrate handling mechanism configured to take out the substrates collectively from the carrier placed on the carrier mount shelf to transport the substrates to the first posture turning mechanism, and configured to return the substrates, on which the single-wafer treatment is performed, to the carrier placed on the carrier mount shelf,
• the treating block including:
• a batch treatment region extending in a direction apart from the transferring block;
• a batch substrate transportation region which is provided along the batch treatment region, whose first end extends to the transferring block, and whose second end extends in a direction apart from the transferring block;
• a single-wafer transportation region extending in a direction apart from the transferring block;
• a single-wafer treatment region provided along the single-wafer transportation region;
• and
• a wet transportation region adjoining the batch treatment region and the single-wafer transportation region,
• the batch treatment region containing a plurality of batch process tanks configured to perform immersion treatment on the substrates collectively and arranged in a direction where the batch treatment region extends,
• the wet transportation region containing a second posture turning mechanism provided on an extension line of a line of the batch process tanks and configured to turn a posture of the substrates, on which the immersion treatment is performed, from vertical to horizontal, a belt conveyor mechanism configured to receive the substrates in a horizontal posture one by one from the second posture turning mechanism and transport the substrates to the single-wafer transportation region, and a liquid supplying unit configured to supply a liquid to wet the substrates, transported by the belt conveyor mechanism, with the liquid,
• the single-wafer treatment region containing a plurality of single-wafer processing chambers, configured to perform treatment on the substrates one by one, arranged in a direction where the single-wafer treatment region extends,
• the single-wafer transportation region containing a single-wafer substrate transport mechanism that can receive the substrates in the horizontal posture, transported by the belt conveyor mechanism and transport the substrates to the single-wafer processing chamber, and can unload the substrates on which the treatment is performed in the single-wafer processing chamber, and
• the batch substrate transportation region containing a batch substrate transport mechanism configured to transport the substrates collectively among a substrate delivery position defined in the transferring block, the batch process tanks, and the second posture turning mechanism.