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US 12,598,938 B2Granted
Device for drying semiconductor substrates
AssigneeSiltronic AG
InventorsSebastian Geissler, Simon Rothenaicher
Life of this patent
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Abstract
A device is for drying disc-shaped substrates. The device has an elongated body, which tapers upwards to form a wedge having an angle α between two upper surfaces and an upper edge. The upper edge is configured to support a disc-shaped substrate. An upper surface of the two upper surfaces has a groove having an increasing groove depth with increasing distance from the upper edge.
Claims11
A device for drying disc-shaped substrates, the device comprising:
- an elongated body, which tapers upwards to form a wedge having an angle α between two upper surfaces and an upper edge,
- wherein the upper edge is configured to support a disc-shaped substrate, and
- wherein an upper surface of the two upper surfaces comprises a groove having an increasing groove depth with increasing distance from the upper edge.
A device for drying a disc-shaped semiconductor wafer, the device comprising:
- an elongated body, which tapers upwards to form a wedge having an angle α between two upper surfaces and an upper edge,
- wherein the upper edge is configured to support the disc-shaped semiconductor wafer,
- wherein an upper surface of the two upper surfaces comprises a groove having an increasing groove depth with increasing distance from the upper edge,
- wherein a curvature radius of the upper edge is not less than 0.1 mm and not more than 1 mm,
- wherein the increasing groove depth has a maximum groove depth of not less than 1 mm and not more than 5 mm, and
- wherein an opening of the groove has a triangular shape and an opening angle of the opening is not less than 80 mm and not more than 100 mm.
3 more elements
A method of treating a disc-shaped semiconductor wafer, the method comprising:
- removing the semiconductor wafer from a bath containing a liquid while the semiconductor wafer resides on a device for drying the disc-shaped semiconductor wafer, the device comprising:
- an elongated body, which tapers upwards to form a wedge having an angle α between two upper surfaces and an upper edge, the upper edge is configured to support the disc-shaped semiconductor substrate, and an upper surface of the two upper surfaces comprises a groove having an increasing groove depth with increasing distance from the upper edge.
Dependencies are inferred from the claim text.