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AssigneeSaint-Gobain Ceramics & Plastics, Inc.
InventorsRenjie Zhou, Lin Fu, Chun-Lung Kuan
Estimating the term…
In one embodiment, a polishing composition can comprise abrasive particles including zirconia, an oxidizing agent including hydroxylamine and water. The polishing composition can have a high copper removal rate of at least 3500 Å/min, and a polishing selectivity of copper to silicon dioxide(Cu:SiO2) can be at least 2.5:1. In another embodiment, a combination product can comprise a first polishing composition and a second polishing composition, wherein each of the first polishing composition and the second polishing composition can comprise abrasive particles including zirconia and an oxidizing agent including hydroxylamine, wherein a hydroxylamine weight % ratio of the first polishing composition to the second polishing composition may be at least 5:1.
A polishing composition comprising zirconia particles, an oxidizing agent including hydroxylamine and water, wherein the polishing composition is designed of polishing a copper substrate with an average material removal rate (MMR) of at least 3500 Å/min according to a copper polishing test, the copper polishing test being conducted at a downforce of 2.5 psi, a platen speed of 120 rpm, a carrier speed of 114 rpm, and a flow rate of 150 ml/min, wherein the zirconia particles include at least 98 wt % zirconia based on the total weight of the zirconia particles, and wherein a pH of the polishing composition is at least 2.5 and not greater than 5.8.
A combination product comprising a first polishing composition and a second polishing composition, wherein
Dependencies are inferred from the claim text.