Semiconductor structure and method for forming the same
AssigneeWinbond Electronics Corp.
InventorWen-Chieh Tsai
Life of this patent
Estimating the term…
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AssigneeWinbond Electronics Corp.
InventorWen-Chieh Tsai
Estimating the term…
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a semiconductor substrate. The semiconductor substrate includes a base portion, a semiconductor bar portion on a first active area of the base portion, a set of semiconductor branch portions extending from a sidewall of the semiconductor bar portion to a second active area of the base portion, and first and second isolation structures formed on the second active area of the base portion. The first interface between the first isolation structure and the semiconductor bar portion is flat. The second interface between the second isolation structure and the semiconductor bar portion is flat. The first interface and the second interface are staggered from each other along the extending direction of the semiconductor bar portion.
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.