Non-metal incorporation in molybdenum on dielectric surfaces

An apparatus for processing substrates, the apparatus comprising:

• first and second process chambers each configured to house a substrate, the first and second process chambers optionally being chambers within a multi-chamber apparatus;
• a substrate support in each of the first and the second process chambers;
• gas inlets configured to direct gas into each of the first and the second process chambers via one or more single or dual plenum showerheads;
• a heater configured to heat the substrate support in each process chamber;
• and
• a controller comprising program instructions for:
• (a) causing sequentially inletting of an oxygen-containing molybdenum precursor and a nitrogen-containing gas into the first process chamber while a substrate is housed in the first process chamber;
• (b) after (a), causing transfer of the substrate to the second process chamber;
• (c) after (b), causing sequentially inletting of an oxygen-containing molybdenum precursor and hydrogen into the second process chamber while the substrate is housed in the second process chamber;
• and
• (d) causing implementation of one or more of the program instructions selected from the group consisting of:
• causing nitrogen to be inletted into the first process chamber when the substrate is housed in the first process chamber,
• causing temperature of the substrate support in the second process chamber to be at two different temperatures while the substrate is housed in the second process chamber,
• causing delivery of a soak gas to the first process chamber before or after sequentially inletting the oxygen-containing molybdenum precursor and the nitrogen-containing gas into the first process chamber, and
• causing reduced flow of hydrogen into the second process chamber while the substrate is housed in the second process chamber.