Display device including electrically connected pad electrodes and manufacturing method thereof

A method for manufacturing a display device, the method comprising:

• providing a first pad electrode on a non-display area of a substrate, the substrate including a display area and the non-display area adjacent to the display area;
• providing a buffer layer and a first insulating layer on the first pad electrode in sequence;
• providing a dummy metal on the first insulating layer, the dummy metal being electrically connected to the first pad electrode through a contact hole in the first insulating layer and the buffer layer;
• providing a second insulating layer on the buffer layer to cover the dummy metal;
• removing a portion of the second insulating layer that overlaps the non-display area in a plan view;
• providing an anode over the display area;
• and
• removing a dummy electrode of the dummy metal disposed on a second pad electrode of the dummy metal,
• wherein a first step, a second step, and a third step include surfaces of the first insulating layer and the buffer layer around the first pad electrode and the second pad electrode, the surfaces of the first insulating layer and the buffer layer including a surface of the first insulating layer connected to a surface of the buffer layer.

A method for manufacturing a display device, the method comprising:

• providing a first pad electrode on a non-display area of a substrate, the substrate including a display area and the non-display area adjacent to the display area;
• providing a buffer layer and a first insulating layer on the first pad electrode in sequence;
• providing a dummy metal on the first insulating layer, the dummy metal being electrically connected to the first pad electrode through a contact hole in the first insulating layer and the buffer layer;
• providing a second insulating layer over the substrate to cover the dummy metal;
• removing a portion of the second insulating layer that overlaps the non-display area in a plan view;
• defining a portion of the first insulating layer disposed around the dummy metal as an outer portion and removing the outer portion from an upper surface of the outer portion to a portion between the upper surface and a lower surface of the outer portion in case that the portion of the second insulating layer is removed;
• and
• removing a dummy electrode of the dummy metal disposed on a second pad electrode of the dummy metal,
• wherein in the removing of the portion of the second insulating layer, a first step and a second step are formed on a periphery of the first insulating layer around the second pad electrode, such that the first step and the second step include surfaces of the first insulating layer and the buffer layer around the first pad electrode and the second pad electrode, the surfaces of the first insulating layer and the buffer layer including a surface of the first insulating layer connected to a surface of the buffer layer.

An electronic device, comprising:

• a display device configured to provide an image, wherein the display device includes
• a pixel,
• a first pad electrode disposed around the pixel,
• a buffer layer disposed on the first pad electrode,
• a first insulating layer disposed on the buffer layer, and
• a second pad electrode disposed on the first insulating layer, the second pad electrode being electrically connected to the first pad electrode through a contact hole in the first insulating layer and the buffer layer,
• wherein a first step, a second step below the first step, and a third step below the second step include surfaces of the first insulating layer and the buffer layer around the first pad electrode and the second pad electrode, the surfaces of the first insulating layer and the buffer layer including a surface of the first insulating layer connected to a surface of the buffer layer.