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US 12,598,845 B2Granted
Solid state optoelectronic device with preformed metal support substrate
AssigneeMicron Technology, Inc.
InventorVladimir Odnoblyudov
Life of this patent
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Abstract
A wafer-level process for manufacturing solid state lighting (“SSL”) devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond.
Claims16
A solid state lighting (“SSL”) device, comprising:
- a light emitting structure having a first semiconductor material at a first side, a second semiconductor material at a second side opposite the first side, and an active region between the first and second semiconductor materials;
- a first contact coupled to the light emitting structure at the first side;
- and
- a second contact coupled to the light emitting structure at the second side, the second contact including:
- a preformed metal substrate, wherein the light emitting structure extends continuously over a surface of the preformed metal substrate and has substantially a same footprint as the preformed metal substrate, and
- a metal bonding structure bonding the preformed metal substrate to the light emitting structure,
- wherein the metal bonding structure comprises a first material and a second material,
- wherein a first boundary region of the metal bonding structure adjacent to the preformed metal substrate comprises a first concentration of the first material,
- wherein a second boundary region of the metal bonding structure adjacent to the light emitting structure comprises a second concentration of the first material lower than the first concentration, and
- wherein a median region disposed between the first boundary region and the second boundary region comprises a third concentration of the first material lower than the first concentration and higher than the second concentration.
7 more elements
A solid state lighting (“SSL”) device, comprising:
- a light emitting structure having a first semiconductor material at a first side, a second semiconductor material at a second side opposite the first side, and an active region between the first and second semiconductor materials;
- a first contact coupled to the light emitting structure at the first side;
- and
- a second contact coupled to the light emitting structure at the second side, the second contact including:
- a preformed metal substrate, wherein the light emitting structure extends continuously over a surface of the preformed metal substrate and has substantially a same footprint as the preformed metal substrate, and
- a metal bonding structure extending continuously over the preformed metal substrate and bonding the preformed metal substrate to the light emitting structure, the metal bonding structure including a first boundary region proximate the preformed metal substrate, a second boundary region proximate the light emitting structure, and a median region between the first and second boundary regions, wherein the median region includes a first concentration of a bonding material, wherein the second boundary region has a second concentration of the bonding material that is less than the first concentration, and wherein the first boundary region has a third concentration of the bonding material that is greater than the first and second concentrations.
3 more elements
Dependencies are inferred from the claim text.