Photonic integrated module with metal embedded chips
AssigneeHRL Laboratories, LLC
InventorsDaniel Yap, Florian G. Herrault, Christopher S. Roper, Partia Naghibi
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Abstract
A photonic module and a method of making same, the module having one or more optoelectronic chips, such as a laser diode typically having six sides, with each optoelectronic chip having two opposing sides (a first side and a second side) abutting and electrically connected to metal regions (preferably electro-formed), the two metal regions are physically distinct and electrically separate from each other, the two electro-formed metal regions serving, in use, as heat spreaders for conducting heat away from the optoelectronic chip.
Claims18
A process for fabricating a photonic module, the process including:
- providing an edge-emitting laser chip having a first and a second opposite sides that are used for making electrical connections to the chip, the laser chip having an active region with a longitudinal laser axis;
- and further comprising two other opposing sides that are neither the first nor the second side, embodied as a third and a fourth opposite sides, wherein one of the third and fourth opposing sides are each normal to the longitudinal laser axis fifth and sixth opposing sides that are neither the first nor the second nor the third nor the fourth sides;
- and
- placing the fifth side of said laser chip on a surface of a carrier substrate such that the third and a fourth opposite sides are normal to the surface of the carrier substrate and the longitudinal laser axis is parallel to the surface of the carrier substrate.
A process for fabricating a photonic module, the process including:
- providing at least one optoelectronic chip having a first and a second opposite sides that are used for making electrical connections to the chip;
- having two other opposing sides that are neither the first nor the second side, embodied as a third and a fourth opposite sides, wherein one of the third and fourth opposing sides is a light coupling side of said optoelectronic chip, and having fifth and sixth opposing sides that are neither the first nor the second nor the third nor the fourth sides;
- and attaching on a surface of a carrier wafer one of the fifth and sixth opposing sides of said optoelectronic chip;
- sandwiching the optoelectronic chip between first and second electrically distinct metal regions arranged to connect electrically the first and second opposing sides, respectively, while serving, in use, as heat spreaders for conducting heat away from the optoelectronic chip;
- wherein the first and second metal regions are arranged at least partially on said surface of the carrier wafer such that there exists a light path to the coupling side of the chip between the first and second metal regions, parallel to said surface of the carrier wafer;
- and
- placing at least one optical element on the carrier substrate, the at least one optical element being arranged for interacting with light coupled to the coupling side of the chip along the light path.
Dependencies are inferred from the claim text.