Noise reduction in silicon-on-insulator devices

A silicon-on-insulator semiconductor die comprising:

• a silicon substrate, an insulating layer disposed above the silicon substrate, a polysilicon layer disposed above the insulating layer, and a plurality of metal layers above the polysilicon layer;
• a plurality of active devices including one or more first active devices each including at least one transistor formed in the silicon-on-insulator semiconductor die and incorporating the polysilicon layer, and one or more second active devices which are non-transistor based active devices;
• and
• a polysilicon ground web formed within the polysilicon layer and connected from the polysilicon layer to a circuit ground via a path formed from the polysilicon layer through the insulating layer and the silicon substrate, a portion of the polysilicon ground web extending between the one or more first active devices and the one or more second active devices, the polysilicon ground web coupling one or more frequencies of radio frequency noise emissions from the plurality of active devices to the circuit ground.

A mobile device, comprising:

• a radio frequency module comprising a silicon-on-insulator die including a silicon substrate, an insulating layer disposed above the silicon substrate, a polysilicon layer disposed above the insulating layer, and a plurality of metal layers above the polysilicon layer;
• a plurality of active devices including one or more first active devices each including at least one transistor formed in the silicon-on-insulator die and incorporating the polysilicon layer, and one or more second active devices which are non-transistor based active devices;
• and a polysilicon ground web formed within the polysilicon layer and connected from the polysilicon layer to a circuit ground via a path formed from the polysilicon layer through the insulating layer and the silicon substrate, a portion of the polysilicon ground web extending between the one or more first active devices and the one or more second active devices, the polysilicon ground web coupling one or more frequencies of radio frequency noise emissions from the plurality of active devices to the circuit ground;
• and
• an antenna coupled to the radio frequency module.