# US 12,598,808 B2 · Display device and method for manufacturing display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,598,808 B2 - Document ID: US12598808B2 - Status: Granted - Kind: B2 - Application number: 18/267,676 - Filed: 2021-12-02 - Published: 2024-02-15 - Granted: 2026-04-07 - Earliest claimed: 2020-12-21 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Hiroaki Ito; Nobuyuki Hasegawa; Fumiaki Haraguchi - Web page: https://patentgrep.com/patent/US12598808B2 ## CPC - H10D 86/441: {Interconnections, e.g. scanning lines} - G09F 9/00: Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements (in which the variable information is permanently attached to a movable support G09F11/00; abacus G06C1/00; slide-rules G06G1/00) - G09F 9/30: in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) - G09F 9/33: being semiconductor devices, e.g. diodes - H05B 33/02: Details - H05B 33/06: Electrode terminals - H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources - H10D 86/021: {of multiple TFTs} - H10D 86/60: wherein the TFTs are in active matrices - H10H 20/80: Constructional details - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10W 90/00: Package configurations - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A display device includes a substrate including a first surface, a side surface, and a second surface opposite to the first surface, a pixel unit located on the first surface and including a light emitter, a first connection pad adjacent to an edge on the first surface and electrically connected to the pixel unit, a second connection pad adjacent to the edge on the second surface, and a side wire extending from the first surface through the side surface to the second surface and connecting the first connection pad and the second connection pad. The first connection pad and the second connection pad have different sizes. ## Claims ### Claim 1 A display device, comprising: a substrate including a first surface, a side surface, and a second surface opposite to the first surface; a pixel unit on the first surface, the pixel unit including a light emitter; a first connection pad adjacent to an edge on the first surface, the first connection pad being electrically connected to the pixel unit; a second connection pad adjacent to the edge on the second surface; and a side wire extending from the first surface through the side surface to the second surface, the side wire connecting the first connection pad and the second connection pad, wherein the second connection pad is larger than the first connection pad and includes an extension extending in a direction along the edge. ### Claim 2 (depends on 1) The display device according to claim 1, wherein the second connection pad is longer than the first connection pad in a direction along the edge. ### Claim 3 (depends on 2) The display device according to claim 2, wherein the first connection pad is between two ends of the second connection pad in the direction along the edge as viewed in a plan view. ### Claim 4 (depends on 1) The display device according to claim 1, wherein the second connection pad is longer than the first connection pad in a direction intersecting with a direction along the edge. ### Claim 5 (depends on 1) The display device according to claim 1, wherein the second connection pad overlaps the first connection pad as viewed in the plan view. ### Claim 6 (depends on 1) The display device according to claim 1, wherein the first connection pad is thicker than the second connection pad. ### Claim 7 (depends on 1) The display device according to claim 1, wherein the first connection pad has a higher conductivity than the second connection pad. ### Claim 8 (depends on 1) The display device according to claim 1, wherein a width in a portion of the side wire connected to the second connection pad is greater than a width in a portion of the side wire connected to the first connection pad. ### Claim 9 (depends on 8) The display device according to claim 8, wherein the side wire from the portion connected to the first connection pad to the portion connected to the second connection pad increases in width. ### Claim 10 (depends on 1) The display device according to claim 1, wherein a thickness in a portion of the side wire connected to the first connection pad is greater than a thickness in a portion of the side wire connected to the second connection pad. ### Claim 11 (depends on 1) The display device according to claim 1, wherein the side wire includes a thicker portion thicker than another portion of the side wire, and the thicker portion is in a portion of the side wire corresponding to the side surface of the substrate. ### Claim 12 (depends on 1) The display device according to claim 1, wherein the light emitter is a micro-light-emitting diode. ### Claim 13 A method for manufacturing a display device, the method comprising: preparing a mother substrate including a first surface, a second surface opposite to the first surface, and a plurality of display device areas on the first surface; forming a plurality of pixel areas on each of the plurality of display device areas; forming a first connection pad on a portion adjacent to an edge on each of the plurality of display device areas; forming a second connection pad on a portion adjacent to the edge on the second surface, the second connection pad being larger than the first connection pad and including an extension extending in a direction along the edge; cutting the mother substrate along the edge of each of the plurality of display device areas to form display device substrates; and forming, on each of the display device substrates, a side wire extending from the first surface through a cut surface being a side surface of each of the display substrates to the second surface to connect the first connection pad and the second connection pad. ### Claim 14 (depends on 13) The method according to claim 13, wherein cutting the mother substrate includes irradiating the second surface with a laser beam along the edge to cut the mother substrate. ### Claim 15 (depends on 13) The method according to claim 13, wherein forming the side wire includes forming a side wire including a stack of a plurality of layers.