Semiconductor device and method for manufacturing the same
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsMakoto Mizukami, Takuma Suzuki, Shunsuke Asaba
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsMakoto Mizukami, Takuma Suzuki, Shunsuke Asaba
Estimating the term…
A semiconductor device includes a first electrode, a first semiconductor layer of a first conductivity type on the first electrode, a first pillar of a second conductivity type on the first semiconductor layer, the first pillar having a first average concentration of impurities, a second pillar of the first conductivity type on the first semiconductor layer, and including a first layer having a second average concentration of impurities lower than the first average concentration, and a second layer having a third average concentration of impurities higher than the first average concentration, a second semiconductor layer of the second conductivity type on the second pillar, a third semiconductor layer of the first conductivity type on the second semiconductor layer, a second electrode connected to the first pillar and the third semiconductor layer, a third electrode, and an insulating film disposed between the second semiconductor layer and the third electrode.
A semiconductor device comprising:
Dependencies are inferred from the claim text.