Vertical semiconductor device and method for fabricating the same
AssigneeSK hynix Inc.
InventorYoo Hyun Noh
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AssigneeSK hynix Inc.
InventorYoo Hyun Noh
Estimating the term…
A method for fabricating a semiconductor device includes forming a source structure over a lower structure with interconnections; forming a first contact plug that penetrates the source structure to be coupled to the interconnections, and a first sacrificial pad that penetrates the source structure and is spaced apart from the first contact plug; forming an upper structure that covers the first sacrificial pad, the first contact plug, and the source structure; forming a second contact plug that penetrates the upper structure and contacts the first contact plug, forming a second sacrificial pad that penetrates the upper structure to contact the first sacrificial pad and is spaced apart from the second contact plug; and replacing the first sacrificial pad and the second sacrificial pad with a dielectric supporter.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.