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US 12,598,750 B2Granted
Manufacturing method of semiconductor device
AssigneeSK hynix Inc.
InventorJong Wook Kim
Life of this patent
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Abstract
In a method of manufacturing a semiconductor device, the method includes: manufacturing a memory chip including memory cells and a dummy cell; and programming the dummy cell before a packaging process of the memory chip is performed, wherein the programming of the dummy cell is performed after the memory chip is completely manufactured.
Claims26
A method of manufacturing a semiconductor device, the method comprising:
- manufacturing a memory chip including memory cells and a dummy cell;
- and
- programming the dummy cell before a packaging process of the memory chip is performed.
A method of manufacturing a semiconductor device, the method comprising:
- manufacturing a memory chip including memory cells and a dummy cell;
- trapping electrons in the dummy cell by performing a program operation;
- and
- moving mobile ions distributed in the memory chip to a region adjacent to the dummy cell by performing a high temperature process, when the electrons are trapped in the dummy cell.
1 more element
Dependencies are inferred from the claim text.