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US 12,598,725 B2Granted
Conformable cold plate for fluid cooling applications
AssigneeIntel Corporation
InventorsBerhanu Wondimu, David Shia, Xudong Tang
Life of this patent
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Abstract
Methods, systems, and apparatus described herein relate to a conformable cold plate for fluid cooling applications. An example method includes re-shaping a tube to contour non-uniform surfaces; and assembling a fluid cooling assembly using the re-shaped tube, the re-shaped tube capable to transfer fluid for cooling of one or more devices.
Claims17
A method comprising:
- re-shaping a first tube to contour to first non-uniform surfaces of a dual inline memory module;
- re-shaping a second tube to contour to second non-uniform surfaces of the dual inline memory module;
- assembling a fluid cooling assembly including the first re-shaped tube and the second re-shaped tube;
- and
- coupling the fluid cooling assembly to a chassis including the dual inline memory module, the coupling of the fluid cooling assembly causing the first non-uniform surfaces to thermally couple with the first re-shaped tube and the second non-uniform surfaces to thermally couple with the second re-shaped tube.
2 more elements
A method comprising:
- shaping a first tube to include a first recessed region and a first protruded region;
- shaping a second tube to include a second recessed region and a second protruded region;
- and
- assembling a fluid cooling assembly including the first and second shaped tubes;
- and
- coupling the fluid cooling assembly to a chassis including a dual inline memory module, the first recessed region and the first protruded region to contour to first non-uniform surfaces of a first side of the dual inline memory module, and the second recessed region and the second protruded region to contour to second non-uniform surfaces of a second side of the dual inline memory module, the fluid cooling assembly to route fluid through the first tube to cool the dual inline memory module.
3 more elements
A method comprising:
- re-shaping a first tube to have a cross-section shape with a first dimension in a first direction and a second dimension in a second direction, the second dimension perpendicular to the first dimension, the first dimension greater than the second dimension;
- re-shaping a second tube to have the cross-section shape;
- assembling a fluid cooling assembly to transfer fluid for cooling of one or more devices, the fluid cooling assembly including the first re-shaped tube and the second re-shaped tube;
- and
- coupling the fluid cooling assembly to a chassis including a dual inline memory module, the first re-shaped tube to contour to a first non-uniform surface of a first side of the dual inline memory module, the second re-shaped tube to contour to a second non-uniform surface of a second side of the dual inline memory module.
2 more elements
Dependencies are inferred from the claim text.