Heat conduction plate assembly structure

A heat conduction plate assembly structure for attaching to a heat-generating component (2), with a heat conduction medium (50) interposed therebetween, the heat conduction plate assembly structure comprising:

• a heat conduction plate (10), comprising a platform (11) disposed corresponding to a center of the heat-generating component (2) and a plurality of holes surrounding the platform (11), the platform (11) comprising an arc surface (111) attached to the heat-generating component (2) and an overflow slot (112) located on a side of the arc surface (111);
• a buffer pad (20), fixed on the platform (11) and surrounding an outer side of the overflow slot (112);
• and
• a glue (30), wherein the buffer pad (20) is combined on the platform (11) through the glue (30), the glue (30) forms a continuous layer fully covering and conformally contacting an entirely surface of the buffer pad (20) that faces the platform (11), and the glue (30) has a uniform thickness across the entire surface of the buffer pad (20);
• wherein the platform (11) comprises a positioning groove (113), and the buffer pad (20) is arranged in and occupying a portion of the positioning groove (113);
• wherein a remaining portion of the positioning groove (113) located at an inner side of the buffer pad (20) is left unoccupied and is defined as the overflow slot (112) to receive overflow of the heat conduction medium (50) melted by heat from the heat-generating component (2);
• wherein a plurality of heat dissipation fins (40) are disposed within a recess formed on an opposite side of the platform (11), and an outermost of the heat dissipation fins (40) at a first side is spaced apart from a sidewall of the recess by a slot and another outermost of the heat dissipation fins (40) at a second side opposite to the first side is adjacent to a sloping sidewall of the recess.