Half-bridge switch arrangement

A half-bridge switch arrangement (1, 100, 200), comprising:

• a high-side switch (10, 110, 210) comprising a plurality of parallel-connected first semiconductor switching elements (11, 111, 211),
• a low-side switch (20, 120, 220) comprising a plurality of parallel-connected second semiconductor switching elements (21, 121, 221),
• a positive busbar (130, 230), to which a first terminal of each of the first semiconductor switching elements (11, 111, 211) of the high-side switch (10, 110, 210) is electrically connected,
• a negative busbar (140, 240), to which a second terminal of each of the second semiconductor switching elements (21, 121, 221) of the low-side switch (20, 120, 220) is electrically connected, and
• a heat sink (180, 280),
• wherein the heat sink (180, 280) has a first section (181, 281) and a second section (185, 285) arranged on the first section (181, 281),
• wherein the first semiconductor switching elements (11, 111, 211) and the second semiconductor switching elements (21, 121, 221) are arranged at the second section (185, 285),
• wherein the positive busbar (130, 230) and the negative busbar (140, 240) are arranged one above the other on an upper side (182, 282) of the first section (181, 281).