Radio frequency module and communication device

A radio frequency module comprising:

• a mounting board having a principal surface;
• an electronic component comprising a plurality of external terminals, the electronic component being mounted on the principal surface of the mounting board by the plurality of external terminals;
• a resin layer on the principal surface of the mounting board, the resin layer covering at least an outer perimeter surface of the electronic component;
• and
• a conductive layer covering the resin layer, the conductive layer overlapping the electronic component in a plan view of the mounting board,
• wherein the plurality of external terminals of the electronic component comprises a first radio-frequency (RF) terminal and a second RF terminal,
• wherein the conductive layer comprises:
• a first conductive portion between the first RF terminal and the second RF terminal in the plan view;
• and
• a second conductive portion adjacent to the first conductive portion in the plan view, and
• wherein a resistivity of the first conductive portion is higher than a resistivity of the second conductive portion.

A radio frequency module comprising:

• a mounting board having a principal surface;
• a first electronic component comprising a plurality of first external terminals, the plurality of first external terminals comprising a first radio-frequency (RF) terminal, the first electronic component being mounted on the principal surface of the mounting board by the plurality of first external terminals;
• a second electronic component comprising a plurality of second external terminals, the plurality of second external terminals comprising a second RF terminal, the second electronic component being mounted on the principal surface of the mounting board by the plurality of second external terminals;
• a resin layer on the principal surface of the mounting board, the resin layer covering at least an outer perimeter surface of the first electronic component and an outer perimeter surface of the second electronic component;
• and
• a conductive layer covering the resin layer, the conductive layer overlapping the first electronic component and the second electronic component in a plan view of the mounting board,
• wherein the conductive layer comprises:
• a first conductive portion between the first RF terminal and the second RF terminal in the plan view;
• and
• a second conductive portion adjacent to the first conductive portion in the plan view,
• wherein the second conductive portion comprises:
• a first metal layer comprising a first metal material;
• and
• a second metal layer that is on the first metal layer and that comprises a second metal material that is different from the first metal material, and
• wherein the first conductive portion comprises an alloy portion comprising the first metal material and the second metal material.