High frequency module and communication apparatus

A high frequency module comprising:

• a module substrate having a first main surface and a second main surface facing each other;
• a power amplifier disposed on the first main surface and configured to amplify a transmission signal;
• a first external connection terminal disposed on the second main surface and set to a ground potential;
• a via conductor provided inside the module substrate and connecting the first main surface to the second main surface;
• and
• a first circuit component disposed on the second main surface in such a manner that at least part of the first circuit component is overlapped with the power amplifier in a plan view of the module substrate,
• wherein one end of the via conductor is bonded to a ground electrode of the power amplifier on the first main surface, and another end of the via conductor is bonded to a first end surface of the first external connection terminal on the second main surface,
• wherein an area of a second end surface opposite to the first end surface of the first external connection terminal is larger than an area of a cut surface in parallel to the second main surface of the first external connection terminal, and
• wherein the first circuit component overlaps the second end surface of the first external connection terminal.