Reconfigurable intelligent surface realized with integrated chip tiling
AssigneeThe Trustees of Princeton University
InventorsSuresh Venkatesh, Xuyang Lu, Hooman Saeidi, Kaushik Sengupta
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AssigneeThe Trustees of Princeton University
InventorsSuresh Venkatesh, Xuyang Lu, Hooman Saeidi, Kaushik Sengupta
Estimating the term…
Disclosed is an electromagnetic-circuit co-design approach for massively reconfigurable, multifunctional, and high-speed programmable metasurfaces with integrated chip tiling. The ability to manipulate the incident electromagnetic fields in a dynamically programmable manner and at high speeds using integrated chip tiling approach is also disclosed. The scalable architecture uses electromagnetic-circuit co-design of metasurfaces where each individual subwavelength meta-element is uniquely addressable and programmable. The disclosed device comprises a large array of such meta-elements. The design relies on integrated high frequency switches designed in conjugation with meta-element for massive reconfigurability of incident amplitude and phase. The disclosed chip is multi-functional and can perform beamforming, high speed spatial light modulation, dynamic holographic projections, and wavefront manipulation.
A device, comprising:
A system, comprising a device comprising one or more electronic tiles, each tile fully integrated into a semiconductor chip, each electronic tile comprising at least one electromagnetic unit cell, each unit cell comprising a resonator element divided into sectors, where adjacent sectors are connected via a switch at a connection point, each switch connected in parallel to a separate subwavelength inductive loop to create a high-resistance path when the switch is open, where each electromagnetic unit cell is programmably activatable by the switch at the connection point;
Dependencies are inferred from the claim text.