Electronic device antenna package with multiple antennas

An electronic device, comprising:

• a first substrate having a first surface;
• a second substrate disposed over the first surface of the first substrate, the second substrate having a first surface configured for providing an external electrical connection to outside the electronic device and a second surface distinct from the first surface of the second substrate;
• and
• a first antenna component disposed over the second surface of the second substrate and having a first surface facing the first substrate, wherein the second surface of the second substrate and the first antenna component are vertically overlapped in a first direction substantially perpendicular to the first surface of the first substrate,
• wherein the first surface of the second substrate and the first antenna component are not vertically overlapped in the first direction;
• a first integrated circuit (IC) device connected to the first surface of the first antenna component and horizontally overlapping the second substrate in a second direction substantially parallel with the first surface of the first substrate, wherein the first IC device is completely covered by the first antenna component in the first direction;
• a third substrate connected to the first surface of the first substrate and the first surface of the first antenna component, wherein the third substrate has a surface facing and spaced apart from the second substrate;
• an encapsulant contacting the first surface of the first substrate, the first surface of the first antenna component, and the surface of the third substrate;
• and
• a second antenna component connected to the third substrate, wherein the second antenna component is horizontally overlapped with the first substrate, the second substrate, the third substrate, and the first antenna component in the second direction.