Package antenna apparatus and wireless communication apparatus

A wireless communication apparatus, comprising:

• a baseband chip;
• and
• a package antenna apparatus, comprising:
• a package substrate, wherein an antenna array is disposed on a first surface of the package substrate;
• and
• a transceiver chip coupled to the antenna array, wherein the transceiver chip is fastened to a second surface of the package substrate that is opposite from the first surface of the package substrate, and wherein the transceiver chip comprises a first pad and a second pad;
• and
• a filter disposed in the package substrate, wherein the filter comprises an input port and an output port, wherein the input port is coupled to the first pad of the transceiver chip, wherein the output port is coupled to the second pad of the transceiver chip, and wherein the filter is configured to filter a signal of the transceiver chip that is input through the input port, and is further configured to output a filtered signal to the transceiver chip through the output port, wherein the filter is disposed within the package substrate between the first surface and the second surface;
• and
• wherein the baseband chip is coupled to the transceiver chip in the package antenna apparatus.