Specially packaged relay and packaging method thereof
AssigneeXiamen Hongfa Electroacoustic Co., Ltd.
InventorsYang Deng, Yiqing Zhu, Zhonghua Tan, Rongjie Chen
Life of this patent
Estimating the term…
Loading patent…
AssigneeXiamen Hongfa Electroacoustic Co., Ltd.
InventorsYang Deng, Yiqing Zhu, Zhonghua Tan, Rongjie Chen
Estimating the term…
The present disclosure discloses a specially packaged relay and a packaging method thereof. The relay includes an electromagnetic relay and an injection molded body. The injection molded body is injection molded outside the electromagnetic relay and wraps the electromagnetic relay therein. A plurality of conventional terminals of the electromagnetic relay are respectively exposed, or the conventional terminals of the electromagnetic relay are respectively located within the injection molded body, and each of the conventional terminals of the electromagnetic relay is connected with an external terminal that is exposed. The electromagnetic relay of the present disclosure is completely wrapped and sealed by the injection molded body, and is completely isolated from external liquid, which can effectively prevent the external liquid from flowing into the electromagnetic relay and ensure the electromagnetic relay to work stably for a long time in a liquid environment.
A packaged relay, comprising an electromagnetic relay, wherein the relay further comprises an injection molded body which is injection molded outside the electromagnetic relay and wraps the electromagnetic relay therein, a plurality of terminals of the electromagnetic relay are respectively exposed, or the plurality of terminals of the electromagnetic relay are respectively located within the injection molded body, and each of the terminals of the electromagnetic relay is connected with an external terminal that is exposed, wherein a plurality of heat dissipation grooves are respectively and circumferentially arranged on outer side surfaces of the injection molded body, and an upper end of the heat dissipation groove protrudes upwardly, and a lower end of the heat dissipation groove does not penetrate through a bottom surface of the injection molded body.
Dependencies are inferred from the claim text.