Multilayer electronic component

A multilayer electronic component comprising:

• a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween;
• and
• an external electrode positioned on the body,
• wherein the external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni),
• an oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer,
• an average thickness of the first plating layer is smaller than an average thickness of the second plating layer, and
• the oxide including nickel (Ni) includes at least one of NiO or Ni2O3.