# US 12,597,531 B2 · Package structure and method of manufacturing the same

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- Number: US 12,597,531 B2
- Document ID: US12597531B2
- Status: Granted
- Kind: B2
- Application number: 18/114,181
- Filed: 2023-02-24
- Published: 2024-08-29
- Granted: 2026-04-07
- Earliest claimed: 2023-02-24
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: Wu Chou Hsu; Hung Yi Chuang; Shin-Luh Tarng
- Web page: https://patentgrep.com/patent/US12597531B2

## CPC

- H01B 1/20: Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)}
- H05K 1/0233: {Filters, inductors or a magnetic substance}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 5/0026: {provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.

## Claims

### Claim 1

A package structure, comprising:
an electronic component comprising a conductive wire and a magnetic layer encapsulating the conductive wire;
a first connection element electrically connected to the conductive wire, wherein the first connection element is disposed outside the magnetic layer; and
an encapsulant encapsulating the conductive wire and separating the first connection element from the magnetic layer, wherein the first connection element has a first surface exposed by an upper surface of the encapsulant and a second surface exposed by a lower surface, opposite to the upper surface, of the encapsulant.

### Claim 2 (depends on 1)

The package structure as claimed in claim 1, wherein the first connection element penetrates the conductive wire.

### Claim 3 (depends on 2)

The package structure as claimed in claim 2, wherein the first connection element extends beyond a top and a bottom of the magnetic layer, the top of the magnetic layer is over the conductive wire, and the bottom of the magnetic layer is below the conductive wire.

### Claim 4 (depends on 2)

The package structure as claimed in claim 2, wherein the conductive wire has a first segment and a second segment spaced apart from the first segment by the first connection element, and wherein the first connection element and the first segment define a first contact surface fully penetrating the conductive wire, and the first connection element and the second segment define a second contact surface fully penetrating the conductive wire.

### Claim 5 (depends on 1)

The package structure as claimed in claim 1, wherein the conductive wire defines a step structure in contact with the first connection element.

### Claim 6 (depends on 5)

The package structure as claimed in claim 5, wherein a portion of the conductive wire is vertically surrounded by the first connection element.

### Claim 7 (depends on 1)

The package structure as claimed in claim 1, further comprising a substrate having a side surface facing the electronic component, wherein the electronic component is embedded in the substrate, and the first connection element is disposed between the side surface of the substrate and the magnetic layer.

### Claim 8 (depends on 7)

The package structure as claimed in claim 7, further comprising a first dielectric layer and a second dielectric layer disposed between the side surface of the substrate and the magnetic layer.

### Claim 9 (depends on 8)

The package structure as claimed in claim 8, wherein the first dielectric layer is separated from the side surface of the substrate by the second dielectric layer.