Automatic detection of mask defects in semiconductor processing

A computer system for detecting a mask defect, comprising:

• one or more processors, one or more computer-readable memories, one or more computer-readable tangible storage devices, and program instructions stored on at least one of the one or more storage devices for execution by at least one of the one or more processors via at least one of the one or more memories, wherein the computer system is capable of performing a method comprising:
• scanning, by the one or more processors, a wafer during a lithography process of semiconductor processing;
• comparing, by the one or more processors, a first chip of a plurality of chips on the wafer with a neighboring chip;
• storing, by the one or more processors, a location of a defect on the first chip, in response to detecting the defect on the first chip during the comparison;
• selecting, by the one or more processors, a second chip of the plurality of chips closest to a center of the wafer;
• scanning, by the one or more processors, the second chip and storing inspection data corresponding to the second chip;
• comparing, by the one or more processors, the inspection data from the second chip with mask pattern data;
• and
• in response to the inspection data from the second chip matching the mask pattern data, allowing, by the one or more processors, the lithography process to continue.

A computer program product for detecting a mask defect, comprising:

• one or more computer readable storage media, and program instructions collectively stored on the one or more computer readable storage media, the program instructions comprising:
• program instructions to scan, by one or more processors, a wafer during a lithography process of semiconductor processing;
• program instructions to compare, by the one or more processors, a first chip of a plurality of chips on the wafer with a neighboring chip;
• program instructions to store, by the one or more processors, a location of a defect on the first chip, in response to detecting the defect on the first chip during the comparison;
• program instructions to select, by the one or more processors, a second chip of the plurality of chips closest to a center of the wafer;
• program instructions to scan, by the one or more processors, the second chip and storing inspection data corresponding to the second chip;
• program instructions to compare, by the one or more processors, the inspection data from the second chip with mask pattern data;
• and
• in response to the inspection data from the second chip matching the mask pattern data, program instructions to allow, by the one or more processors, the lithography process to continue.