Wafer pattern identification system and method

A system for identifying a wafer pattern associated with a wafer, comprising:

• a memory configured to store instructions;
• and
• a processor coupled to the memory and configured to execute the instructions to perform a process comprising:
• receiving measurement data associated with the wafer pattern, wherein the measurement data comprises a plurality of measurement values for a plurality of dies on the wafer, respectively;
• converting the measurement data into a vector of the wafer pattern at least by:
• converting a first subset of the measurement values each being smaller than a threshold into a first subset of vector elements each having a zero value, respectively;
• and
• converting a second subset of the measurement values each being equal to or greater than the threshold into a second subset of vector elements each having a predetermined non-zero value, respectively;
• determining a similarity value between the vector of the wafer pattern and a reference vector of a reference pattern associated with a reference wafer;
• identifying a failure mode associated with the wafer pattern based on the reference pattern of the reference wafer and the similarity value between the vector of wafer pattern and the reference vector of the reference pattern;
• determining if the identified failure mode is due to a process change in a manufacturing process of the plurality of dies on the wafer or a failure of a manufacturing equipment manufacturing the plurality of dies on the wafer;
• and
• responsive to the identified failure mode being due to the process change in the manufacturing process, adjusting the process change to manufacture a corrected plurality of dies on a new wafer;
• or, responsive to the identified failure mode being due to the failure of the manufacturing equipment, correcting the failure of the manufacturing equipment to manufacture the corrected plurality of dies on the new wafer.

A non-transitory computer-readable storage medium configured to store instructions which, in response to an execution by a processor, cause the processor to perform a process comprising:

• receiving measurement data associated with a wafer pattern, wherein the measurement data comprises a plurality of measurement values for a plurality of dies on the wafer, respectively;
• converting the measurement data into a vector of the wafer pattern at least by:
• converting a first subset of the measurement values each being smaller than a threshold into a first subset of vector elements each having a zero value, respectively;
• and
• converting a second subset of the measurement values each being equal to or greater than the threshold into a second subset of vector elements each having a predetermined non-zero value, respectively;
• determining a similarity value between the vector of the wafer pattern and a reference vector of a reference pattern associated with a reference wafer;
• identifying a failure mode associated with the wafer pattern based on the reference pattern of the reference wafer and the similarity value between the vector of wafer pattern and the reference vector of the reference pattern;
• determining if the identified failure mode is due to a process change in a manufacturing process of the plurality of dies on the wafer or a failure of a manufacturing equipment manufacturing the plurality of dies on the wafer;
• and
• responsive to the identified failure mode being due to the process change in the manufacturing process, adjusting the process change to manufacture a corrected plurality of dies on a new wafer;
• or, responsive to the identified failure mode being due to the failure of the manufacturing equipment, correcting the failure of the manufacturing equipment to manufacture the corrected plurality of dies on the new wafer.