Control scheme for regulating thermoelectric cooling device power for a computing device
AssigneeAdvanced Micro Devices, Inc.
InventorsMichael J. Austin, Christopher M. Helberg, Sukesh Shenoy, Christopher M. Jaggers
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Abstract
An apparatus for component cooling includes a thermoelectric cooling (TEC) device configured to be thermally coupled to a first processor, and a controller. The controller is configured to receive at least one first parameter indicative of a first activity level of the first processor; determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter; and control providing of power to the TEC device at the determined TEC power level.
Claims19
An apparatus for component cooling, comprising:
- a thermoelectric cooling (TEC) device configured to be thermally coupled to a first system component, wherein the first system component comprises a first processor, and wherein the TEC device is configured to cool the first system component;
- and
- a controller comprising a processor and memory storing instructions executable to:
- receive at least one first parameter indicative of a first activity level of the first processor;
- receive at least one second parameter indicative of a second activity level of a second system component, wherein the second system component is physically separate from the TEC device, and wherein the TEC device is configured to cool the second system component;
- determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter and on the at least one second parameter;
- and control providing of power to the TEC device at the determined TEC power level.
A system comprising:
- a first processor;
- a thermoelectric cooling (TEC) device configured to be thermally coupled to the first processor, and wherein the TEC device is configured to cool the first processor;
- a second processor;
- a power supply;
- and
- a controller comprising a processor and memory storing instructions executable configured to:
- receive at least one first parameter indicative of a first activity level of the first processor;
- receive at least one second parameter indicative of a second activity level of the second processor, wherein the second processor is physically separate from the TEC device, and wherein the TEC device is configured to cool the second processor;
- determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter and the at least one second parameter;
- and
- control providing of power to the TEC device from the power supply at the determined TEC power level.
A method for component cooling, comprising:
- receiving, by a controller, at least one first parameter indicative of a first activity level of a first processor thermally coupled to a thermoelectric cooling (TEC) device, and wherein the TEC device is configured to cool the first processor;
- receiving, by the controller, at least one second parameter indicative of a second activity level of a second system component, wherein the second system component is, physically separate from the TEC device, and wherein the TEC device is configured to cool the second system component;
- determining, by the controller, a TEC power level from among a plurality of TEC power levels based on the at least one first parameter and the at least one second parameter;
- and
- controlling, by the controller, providing of power to the TEC device at the determined TEC power level.
Dependencies are inferred from the claim text.