Thermal improvements for memory sub-systems

Abstract

Some memory sub-systems are operated in high temperature and low airflow environments. As a safeguard, thermal throttling may limit throughput on a memory sub-system when a predetermined temperature is reached or exceeded. Improving heat dissipation increases the amount of time a memory sub-system can operate without initiating thermal throttling. Adding a phase-change material (PCM) with a melting temperature above the ambient temperature but below the thermal throttling temperature to a memory sub-system increases the amount of heat the memory sub-system can generate before the temperature reaches the thermal throttling temperature. Thermally coupling components with a heat spreading sheet causes the temperature of the components to vary less than when the components transfer heat by air. Thus, a component that generates less heat may be used to absorb heat generated by another component, increasing the amount of time before any component reaches the thermal throttling temperature.

Dependencies are inferred from the claim text.