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US 12,596,308 B2Granted
Modular wafer table and methods of manufacturing thereof
AssigneeASML Netherlands B.V.
InventorsShahab Shervin, Tammo Uitterdijk, Matthew Lipson, Marcus Martinus Petrus Adrianus Vermeulen
Life of this patent
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Abstract
The present disclosure is directed to a modular wafer table and methods for refurbishing a scrapped wafer to manufacture the modular wafer table. The method comprises removing one or more burls from a surface of a wafer table; polishing the surface of the wafer table after removing the one or more burls to form a core module; forming a burl module having a plurality of burls thereon; and bonding the core module to the burl module.
Claims20
A method, comprising:
- removing burls from a surface of a wafer table;
- polishing the surface of the wafer table after removing the burls to form a core;
- forming a plurality of burls on a separate substrate;
- and
- bonding the core to the substrate.
2 more elements
A wafer table, comprising:
- a core comprising a surface that is configured to have all burls removed before polishing the surface;
- a substrate comprising a plurality of burls formed thereon;
- and
- a plurality of bonding contacts configured to bond together the core to the substrate.
1 more element
A lithographic apparatus, comprising:
- an illumination system configured to condition a radiation beam;
- a projection system configured to project a pattern imparted to the radiation beam by a patterning device onto a target portion of a wafer;
- a wafer table configured to hold the wafer, the wafer table comprising:
- a core comprising a polished surface without burls;
- a substrate comprising a plurality of burls formed thereon;
- and
- a plurality of bonding contacts configured to bond together the core to the substrate.
4 more elements
Dependencies are inferred from the claim text.