Multi-wire bonding test circuit for a converter

A power converter, comprising:

• a plurality of nodes including first, second, third and fourth nodes;
• and
• a wire bonding test circuit including:
• a multiplexer having:
• a first terminal of a first side coupled to the first node,
• a second terminal of a second side, and
• a third terminal of the second side;
• a first switch having:
• a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
• a second terminal coupled to the second node;
• a second switch having:
• a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
• a second terminal coupled to the third node;
• and
• a third switch having:
• a first terminal coupled to the second terminal or the third terminal of the multiplexer, and
• a second terminal coupled to the fourth node;
• a plurality of pads including first, second and third pads;
• and
• a plurality of pins including first and second pins, wherein the first node is coupled to the first pad, and the first pad is coupled to the first pin by a first bonding wire, wherein the fourth node is coupled to the second and third pads, the second pad is coupled to the second pin by a second bonding wire, and the third pad is coupled to the second pin by a third bonding wire
• a controller configured to operate the wire bonding test circuit in a third configuration in which a path is provided between the first and second pins for testing a conductivity of the second bonding wire or the third bonding wire, operating the wire bonding test circuit in the third configuration includes causing:
• the multiplexer to be conductive between the first and third terminals of the multiplexer;
• the third switch to be conductive;
• and
• the first and second switches to be non-conductive.

A method, comprising:

• operating a multiplexer of a wire bonding test circuit to couple a first terminal of the multiplexer to a second terminal of the multiplexer or to couple the first terminal of the multiplexer to a third terminal of the multiplexer, wherein the first terminal of the multiplexer is coupled to a first node of a power converter;
• operating a first switch of the wire bonding test circuit in a conductive or a non-conductive state, wherein the first switch has a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to a second node of the power converter;
• operating a second switch of the wire bonding test circuit in a conductive or a non-conductive state, wherein the second switch has a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to a third node of the power converter;
• and
• operating a third switch of the wire bonding test circuit in a conductive or a non-conductive state, wherein the third switch has a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to a fourth node of the power converter, wherein the power converter includes:
• a first switching transistor having a first conduction terminal coupled to the second node, a second conduction terminal coupled to the third node, and a control terminal configured to receive a first driving signal;
• and
• a second switching transistor having a first conduction terminal coupled to the third node, a second conduction terminal coupled to the fourth node, and a control terminal configured to receive a second driving signal.