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US 12,595,622 B2Granted
Fabric substrate and manufacturing method thereof
AssigneeKorea Advanced Institute of Science and Technology
InventorsKyung Cheol Choi, Seung Yeop Choi, Seon Il Kwon
Life of this patent
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Abstract
According to the present invention, there is provided a fabric substrate for mounting a light emitting element. The fabric substrate comprises a fabric layer including at least one fabric, a stress buffer layer that is disposed on the fabric layer and minimizes an occurrence of physical strain and stress caused by bending the fabric layer, and a flattening layer that is disposed on the stress buffer layer and provides a flat surface to allow a light emitting element to operate.
Claims7
A manufacturing method of a fabric substrate, comprising:
- forming a metal pattern layer with a predetermined pattern on a support substrate;
- disposing a sacrificial layer on the support substrate and the metal pattern layer and disposing a flattening layer on the sacrificial layer;
- curing at least one portion of the flattening layer by irradiation with UV rays in a direction of a lower surface of the support substrate;
- disposing a stress buffer layer on the flattening layer, disposing a fabric layer on the stress buffer layer, and applying predetermined pressure in a direction of the fabric layer;
- and
- generating a fabric substrate in which the flattening layer, the stress buffer layer, and the fabric layer are sequentially stacked, by removing the sacrificial layer disposed between the support substrate and the flattening layer and selectively etching a portion of the flattening layer, in which UV curing is not caused, with a developer.
3 more elements
Dependencies are inferred from the claim text.