Embedding electronic devices using electrochemical additive manufacturing

An electrochemical additive manufacturing method, comprising steps of:

• coupling a first electronic device to a build plate;
• positioning the build plate into an electrolyte solution such that a cathode portion of the build plate directly contacts the electrolyte solution;
• positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the cathode portion and the deposition anode array;
• connecting the cathode portion of the build plate to a power source;
• connecting one or more deposition anodes of the plurality of deposition anodes to the power source;
• and
• transmitting electrical energy from the power source, through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion and forms at least a sidewall of a shell that encases the first electronic device against the build plate when the first electronic device is coupled to the build plate, wherein the shell and the first electronic device form a second electronic device;
• wherein the step of coupling the first electronic device to the build plate occurs before the step of transmitting the electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion.

An electrochemical additive manufacturing method, comprising steps of:

• coupling a first electronic device to a build plate;
• positioning the build plate into an electrolyte solution such that a cathode portion of the build plate directly contacts the electrolyte solution;
• positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the cathode portion and the deposition anode array;
• connecting the cathode portion of the build plate to a power source;
• connecting one or more deposition anodes of the plurality of deposition anodes to the power source;
• and
• transmitting electrical energy from the power source, through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion and forms at least a sidewall of a shell that encases the first electronic device against the build plate when the first electronic device is coupled to the build plate, wherein the shell and the first electronic device form a second electronic device;
• wherein:
• the first electronic device comprises an electrically conductive portion;
• the build plate is positioned into the electrolyte solution such that the electrically conductive portion of the first electronic device directly contacts the electrolyte solution;
• and
• the electrochemical additive manufacturing method further comprises:
• connecting the electrically conductive portion of the first electronic device to the power source;
• and
• transmitting electrical energy from the power source, through at least one deposition anode of the plurality of deposition anodes, through the electrolyte solution, and to the electrically conductive portion of the first electronic device, such that material is deposited onto the electrically conductive portion of the first electronic device.