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US 12,595,268 B2Granted
Acid anhydride compound, and polyamideimide resin and film using the same
AssigneeKorea Advanced Institute of Science and Technology
InventorsSang Youl Kim, Seong Jong Kim
Life of this patent
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Abstract
Provided are an acid anhydride compound having a novel structure, and a polyamideimide resin and a polyamideimide film produced therefrom. Specifically, since the polyamideimide film according to the present invention includes a structural unit derived from the acid anhydride compound, it may have high thermal resistance and a low coefficient of thermal expansion while being colorless and transparent.
Claims11
A polyamideimide comprising:
- a structural unit derived from an acid anhydride compound represented by the following Chemical Formula 1 and a structural unit derived from an aromatic diamine:
- wherein
- R1, R2, are independently of each other hydrogen, (C1-C20)alkyl, fluoro(C1-C20)alkyl, (C6-C20)aryl, or (C3-C20) heteroaryl, and at least one of R1 and R2 is fluoro (C1-C20)alkyl, (C6-C20)aryl or (C3-C20) heteroaryl and X1 is O or SO2.
Dependencies are inferred from the claim text.