# US 12,594,715 B2 · 3D printing device, and method for preparing 3D printed structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,594,715 B2 - Document ID: US12594715B2 - Status: Granted - Kind: B2 - Application number: 18/999,708 - Filed: 2024-12-23 - Published: 2025-04-17 - Granted: 2026-04-07 - Earliest claimed: 2019-02-18 - Assignees: Institute of Chemistry, Chinese Academy of Sciences - Applicants: Institute of Chemistry, Chinese Academy of Sciences - Inventors: Lei Wu; Yanlin Song - Web page: https://patentgrep.com/patent/US12594715B2 ## CPC - B29C 64/112: using individual droplets, e.g. from jetting heads - B22F 10/00: Additive manufacturing of workpieces or articles from metallic powder (apparatus or devices therefor B22F12/00) - B22F 12/44: characterised by the configuration of the radiation means - B29C 64/245: Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) - B29C 64/264: Arrangements for irradiation - B29C 64/286: Optical filters, e.g. masks - B29C 64/295: Heating elements - B33Y 10/00: Processes of additive manufacturing - B33Y 30/00: Apparatus for additive manufacturing; Details thereof or accessories therefor - B33Y 40/10: Pre-treatment - B33Y 70/00: Materials specially adapted for additive manufacturing - B22F 12/30: Platforms or substrates - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ## Abstract Disclosed are a 3D printing device, and a method for preparing a 3D printed structure. The device comprises a curing system (1), and a curing pattern player (6), a flat curing surface (2) with dewettability, and a receiving base (4) capable of moving upwards and away from the flat curing surface, with same being successively arranged above the curing system (1), wherein a curing medium provided by the curing system (1) passes through the curing pattern, so that ink between the flat curing surface (2) and the receiving base (4) is cured. ## Claims ### Claim 1 A method of producing a 3D printed structure, the method comprising the following steps: (A) providing a 3D printing device comprising: a curing system; a curing pattern player; a flat curing surface with de-wettability; and a receiving base capable of moving upwards and away from the flat curing surface; the receiving base, the flat curing surface, and the curing pattern player being successively arranged above the curing system; (B) placing ink droplets on a surface of the flat curing surface with dewettability, and passing the receiving base through the ink droplets such that a lower end surface of the receiving base is brought into proximity with the flat curing surface; (C) causing the curing pattern player to project a curing pattern; (D) causing a curing medium provided by the curing system to pass through the curing pattern, so that the ink droplets filled between the flat curing surface and the receiving base are cured, forming a cured layer with the curing pattern; (E) moving the receiving base upwards; and (F) causing the curing pattern player to project curing patterns that reflect the different structural layers of a target 3D printed structure, and repeating steps (D) and (E), thereby forming a 3D printed structure through a layer-by-layer growth. ### Claim 2 (depends on 1) The method according to claim 1, wherein the adhesion of the cured layer to the flat curing surface is less than 20 kPa. ### Claim 3 (depends on 1) The method according to claim 1, wherein a speed of moving the receiving substrate up is the product of a speed of playing the curing pattern and a thickness of the curing layer, a switching speed of the curing pattern is 1-20 sheets/sec, and a thickness of the cured layer is 1-20 microns/layer. ### Claim 4 (depends on 1) The method according to claim 1, wherein a dynamic contact angle between the ink droplets and the flat curing surface is ≤30°. ### Claim 5 (depends on 1) The method according to claim 1, wherein the curing comprises one or more of photocuring, thermal curing and electric curing. ### Claim 6 (depends on 1) The method according to claim 1, wherein: the ink droplets are one or more selected from the group consisting of a liquid ink containing free ions, a photo-curable resin, a thermosetting resin and a liquid metal; the free ions are one or more selected from the group consisting of metal ions, inorganic ions and organic ions, and the liquid ink is an aqueous solution, a non-aqueous solution or a molten salt; the photosensitive wavelength of the photocurable resin is between 200 nm and 1000 nm; the thermosetting resin has a heat-sensitive temperature within a range of 30° C.-1,500° C.; and the liquid metal is one or more of liquid Bi, liquid Sn, liquid Pb, liquid In, and liquid Ga. ### Claim 7 (depends on 2) The method of claim 2, wherein the adhesion of the cured layer to the flat curing surface is less than 15 kPa. ### Claim 8 (depends on 2) The method of claim 2, wherein the adhesive force between the cured layer and the flat curing surface is less than 10 kPa. ### Claim 9 (depends on 3) The method of claim 3, wherein the switching speed of the curing pattern is within a range of 1-5 layer/s, and the thickness of the cured layer is within a range of 5-10 μm/layer. ### Claim 10 (depends on 4) The method of claim 4, wherein the dynamic contact angle between the ink droplets and the flat curing surface is less than or equal to 20°. ### Claim 11 (depends on 4) The method of claim 4, wherein the dynamic contact angle between the ink droplets and the flat curing surface is less than or equal to 10°. ### Claim 12 (depends on 5) The method of claim 5, wherein: the photo-curing has a light emission wavelength within a range of 300-450 nm; a curing temperature of the thermal curing is within a range of 30° C.-300° C.; and conditions of the electrical curing comprise either static electricity with a touch discharge voltage within a range of 8-20 kV, or static electricity with an air discharge voltage within a range of 15-30 kV. ### Claim 13 (depends on 6) The method of claim 6, wherein: the free ions are one or more selected from the group consisting of gold ions, silver ions, copper ions and iron ions; the photo-curable resin has a photosensitive wavelength within a range of 300-450 nm; and the thermosetting resin has a heat-sensitive temperature within a range of 30° C.-300° C. ### Claim 14 (depends on 6) The method of claim 6, wherein: the photo-curable resin is one or more selected from the group consisting of polymethyl methacrylate, polyacrylic resin, epoxy acrylic resin, polyurethane acrylic resin, polyester acrylic resin, polyether acrylic resin, phenolic resin, a pre-polymer of acrylonitrile-butadiene styrene copolymer, silicone hydrogel resin, allyl resin and vinyl resin; and the thermosetting resin is one or more selected from the group consisting of polymethyl methacrylate, polyacrylic resin, epoxy resin, epoxy acrylic resin, polyurethane acrylic resin, polyester acrylic resin, polyether acrylic resin, phenolic resin, acrylonitrile-butadiene-styrene resin, silicone hydrogel resin, allyl resin and vinyl resin.