# US 12,594,644 B2 · Polishing head assembly having recess and cap > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,594,644 B2 - Document ID: US12594644B2 - Status: Granted - Kind: B2 - Application number: 17/806,378 - Filed: 2022-06-10 - Published: 2022-12-29 - Granted: 2026-04-07 - Earliest claimed: 2021-06-25 - Assignees: GlobalWafers Co., Ltd. - Applicants: GlobalWafers Co., Ltd. - Inventors: Peter Daniel Albrecht; Chih Yuan Hsu; Jen Chieh Lin; Wei Chang Huang; Yau-Ching Yang - Web page: https://patentgrep.com/patent/US12594644B2 ## CPC - B24B 37/26: characterised by the shape of the lapping pad surface, e.g. grooved - B24B 37/32: Retaining rings - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a top portion and a recess along a bottom portion. The recess has a recessed surface. Holes extend from the top portion through the recessed surface. The cap is positioned within the recess and the cap has an annular wall and a floor extending across the annular wall. The annular wall has apertures corresponding to the holes. The floor is spaced from the recessed surface to form a chamber therebetween. The polishing head assembly also includes a band that circumscribes a portion of the annular wall. The holes and the corresponding apertures receive fasteners to removably secure the annular wall to the recessed surface. ## Claims ### Claim 1 A polishing head assembly for polishing of semiconductor wafers, the polishing head assembly comprising: a polishing head having a top portion and a downwardly extending annular member defining a recess along a bottom portion, the recess having a recessed surface, and holes extending from the top portion through the recessed surface; a cap positioned within the recess, the cap having an annular wall and a floor extending across the annular wall, the floor having a bottom surface and a top surface and being spaced from the recessed surface to form a chamber between the recessed surface and the top surface, wherein the annular wall has apertures corresponding to the holes, and wherein the cap is made of a metallic material; and a band circumscribing a first portion of the annular wall, wherein the band is made of a non-metallic material; wherein the annular member circumscribes a second portion of the annular wall; wherein the thickness of the annular wall in a radial direction is greater at a top portion than at a bottom portion; and wherein the holes and the corresponding apertures receive fasteners to removably secure the annular wall of the cap to the recessed surface of the polishing head. ### Claim 2 (depends on 1) The polishing head assembly of claim 1, wherein the band is non-unitary having at least two segments. ### Claim 3 (depends on 2) The polishing head assembly of claim 2, wherein the band has an interlocking member to secure the band to the annular wall. ### Claim 4 (depends on 1) The polishing head assembly of claim 1, wherein the band is a unitary one-piece band. ### Claim 5 (depends on 1) The polishing head assembly of claim 1, wherein the band is made of the non-metallic material is selected from the group consisting of polyetherimide, polyether ether ketone, polyphenylene sulfide, and polyethylene terephthalate. ### Claim 6 (depends on 1) The polishing head assembly of claim 1, wherein the annular wall has a top edge that contacts the recessed surface when the annular wall and the recessed surface are secured. ### Claim 7 (depends on 6) The polishing head assembly of claim 6, wherein the top edge comprises an o-ring forming a seal when the annular wall and the recessed surface are secured. ### Claim 8 (depends on 1) The polishing head assembly of claim 1, further comprising a template attached to the bottom surface of the floor, the template comprising a backing film. ### Claim 9 (depends on 8) The polishing head assembly of claim 8, wherein the template is attached to the bottom surface using a pressure sensitive adhesive. ### Claim 10 (depends on 8) The polishing head assembly of claim 8, wherein the template extends outward past an outer surface of the annular wall such that the band overlaps a portion of the template. ### Claim 11 (depends on 10) The polishing head assembly of claim 10, wherein a pressure sensitive adhesive forms a seal at the portion of the template overlapped by the band. ### Claim 12 (depends on 8) The polishing head assembly of claim 8, wherein the template further comprises a retaining ring extending downward from the backing film. ### Claim 13 (depends on 12) The polishing head assembly of claim 12, wherein the retaining ring forms an opening to receive a semiconductor wafer, and wherein a height of the wafer is greater than a height of the retaining ring. ### Claim 14 (depends on 13) The polishing head assembly of claim 13, wherein the template is used with a liquid to retain the wafer on the polishing head assembly by surface tension. ### Claim 15 A polishing head assembly for polishing of semiconductor wafers, the polishing head assembly comprising: a polishing head having a top portion and a downwardly extending annular member defining a recess along a bottom portion, the recess having a recessed surface, and holes extending from the top portion through the recessed surface; a cap positioned within the recess, the cap having an annular wall extending between and upper surface and a floor extending across the annular wall, the floor being spaced from the recessed surface to form a chamber therebetween, wherein the annular wall has a first portion and a second portion, the first portion having apertures corresponding to the holes, the second portion extending downward from the first portion, and wherein the cap is made of a metallic material, wherein the thickness of the annular wall adjacent the upper surface is greater than a thickness of the annular wall adjacent the floor; and a unitary one-piece band circumscribing the second portion of the annular wall, wherein the band is made of a non-metallic material; wherein the annular member circumscribes a second portion of the annular wall; wherein the holes and the corresponding apertures receive fasteners to removably secure the first portion of the annular wall of the cap to the recessed surface of the polishing head; and wherein the first portion of the annular wall has a first o-ring forming a seal when the first portion and the recessed surface are secured. ### Claim 16 (depends on 15) The polishing head assembly of claim 15, wherein the cap has a tab extending outward from the second portion of the annular wall, and a second o-ring forming a seal between the tab and the band. ### Claim 17 (depends on 15) The polishing head assembly of claim 15, wherein the band is made of a non-metallic material selected from the group consisting of polyetherimide, polyether ether ketone, polyphenylene sulfide, and polyethylene terephthalate.