# US 12,594,581 B2 · Electronic device

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- Number: US 12,594,581 B2
- Document ID: US12594581B2
- Status: Granted
- Kind: B2
- Application number: 17/990,862
- Filed: 2022-11-21
- Published: 2023-05-25
- Granted: 2026-04-07
- Earliest claimed: 2021-11-22
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Eiji Osawa; Hikaru Iwai; Masahiro Komatsu
- Web page: https://patentgrep.com/patent/US12594581B2

## CPC

- B06B 1/0629: {Square array}
- G01H 11/08: using piezoelectric devices
- H10N 30/06: Forming electrodes or interconnections, e.g. leads or terminals
- H10N 30/2047: {Membrane type}
- H10N 30/875: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins}
- H10N 30/877: {Conductive materials}
- B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R)
- G01H: MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

An electronic device includes a first substrate including a first face on which a common terminal to be coupled to the element is disposed, and a second substrate which has a second face and a third face, and which is arranged so that the second face faces to the first face, wherein the second substrate has a first through hole at a position corresponding to the common terminal, the first through hole penetrating from the second face to the third face, a first through electrode electrically coupled to the common terminal is disposed in the first through hole, and a void is disposed in a part of the first through electrode.

## Claims

### Claim 1

An electronic device comprising:
a first substrate including a first face on which an element and a first electrode to be coupled to the element is disposed; and
a second substrate which has a second face and a third face, and which is disposed so that the second face faces to the first face, wherein
the second substrate has a through hole at a position corresponding to the first electrode, the through hole penetrating from the second face to the third face,
a through electrode is provided in the through hole and electrically coupled to the first electrode, and
a void is disposed in a part of the through electrode.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein
a ratio of a volume of the void to a volume of the through hole is no lower than 1% and no higher than 50%.

### Claim 3 (depends on 1)

The electronic device according to claim 1, wherein
defining a stacking direction of the first substrate and the second substrate as a first direction, a ratio of a length in the first direction of the void to a length in the first direction of the through hole is no lower than 25% and no higher than 95%.

### Claim 4 (depends on 3)

The electronic device according to claim 3, wherein
defining a direction perpendicular to the first direction as a second direction, a ratio of a length in the second direction of the void to a length in the second direction of the through hole is no lower than 10% and no higher than 60%.

### Claim 5 (depends on 1)

The electronic device according to claim 1, wherein
the element is a piezoelectric element.

### Claim 6 (depends on 1)

The electronic device according to claim 1, wherein
the through electrode is resin including silver filler.

### Claim 7 (depends on 1)

The electronic device according to claim 1, further comprising:
a third substrate which has a second electrode electrically coupling to the through electrode, and which is disposed so as to be opposed to the third face.