Package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsAn-Hsuan Hsu, Cheng-Yuan Kung, Yaohsin Chou
Life of this patent
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Abstract
A package structure is provided. The package structure includes a substrate, a wiring structure, and a wire bundle structure. The wiring structure is over the substrate. The wire bundle structure is between the wiring structure and the substrate. The wire bundle structure includes a first wire bundle extending from the substrate and a second wire bundle extending from the wiring structure and contacting the first nanowire bundle. The wire bundle structure is configured to reduce a variation in a distance of a gap between the substrate and the wiring structure.
Claims20
A package structure, comprising:
- a substrate;
- a redistribution layer (RDL) over the substrate;
- and
- a wire bundle structure between the RDL and the substrate, wherein the wire bundle structure comprises a first nanowire and a second nanowire extending from the substrate and a third nanowire extending from the RDL, wherein the third nanowire is tangled with the first nanowire and the second nanowire.
A package structure, comprising:
- a substrate including a dielectric structure and a conductive structure formed in the dielectric structure;
- an electronic module over the substrate;
- a filling layer between the electronic module and the substrate;
- and
- a wire bundle structure in the filling layer, wherein the wire bundle structure comprises a tangled portion at least partially within an opening of the dielectric structure of the substrate.
A package structure, comprising:
- a semiconductor substrate;
- a wiring structure over the semiconductor substrate, the wiring structure including a dielectric structure and a conductive structure formed in the dielectric structure;
- and
- a wire bundle structure between the wiring structure and the semiconductor substrate, wherein the wire bundle structure comprises a first nanowire bundle extending from the semiconductor substrate and a second nanowire bundle in contact with and extending from a lower surface of the wiring structure, wherein the first nanowire bundle contacts the second nanowire bundle.
Dependencies are inferred from the claim text.