Power module

A power module comprising:

• a lower ceramic substrate;
• an upper ceramic substrate disposed over the lower ceramic substrate and configured to have a semiconductor chip mounted in a flip chip form on a lower surface of the upper ceramic substrate;
• a PCB substrate disposed over the upper ceramic substrate;
• a plurality of through holes formed to correspond to the upper ceramic substrate and the PCB substrate;
• and
• a connection pin formed in the through hole of the upper ceramic substrate and the through hole of the PCB substrate in a way to penetrate through the through holes and configured to perpendicularly connect an electrode pattern of the upper ceramic substrate and an electrode pattern of the PCB substrate;
• wherein the connection pin formed in the through hole in a way to penetrate through the through holes is bonded to the electrode pattern of the upper ceramic substrate at an edge of the through hole by laser welding,
• further comprising a solder layer coated on the electrode pattern at the edge of the through hole of the upper ceramic substrate, melted upon the laser welding, and configured to bond the connection pin to the electrode pattern at the edge of the through hole of the upper ceramic substrate.