US 12,593,733 B2Granted

Vertical light emitting diode die packaging method

AssigneeIngentec Corporation

InventorsHsiao Lu Chen, Ai Sen Liu, Hsiang An Feng

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Abstract

A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a second metal material, and a transparent glue is used to cover thereon. A laser process is then employed to dissolve the transparent glue for forming ditches. And, a conductive liquid is applied to fill the ditches and an insulating glue is provided to embrace and encapsulate the vertical light emitting diode dies. By employing the packaging method of the present invention, the current external wire bonding process can be effectively replaced, thereby die size miniaturization as well as packaging yield of the vertical light emitting diode dies are believed to be optimized.

Claims14

Dependent claims

A vertical LED (light emitting diode) die packaging method, comprising:

providing a substrate and forming a plurality of drill hole in the substrate;
filling the plurality of drill hole with a first metal material, and coating a second metal material on an upper surface of the plurality of drill hole;
disposing a plurality of vertical light emitting diode die and fixing the plurality of vertical light emitting diode die on the substrate through the second metal material;
covering the plurality of vertical light emitting diode die with a transparent glue and performing a laser process to dissolve the transparent glue such that a plurality of ditch is formed, wherein each of the plurality of ditch is connected to at least one of the plurality of vertical light emitting diode die;
applying a conductive liquid to fill each of the plurality of ditch, and the conductive liquid is made of nano silver wire;
and
providing an insulating glue to embrace the plurality of vertical light emitting diode die such that the plurality of vertical light emitting diode die is encapsulated.

4 more elements

Dependencies are inferred from the claim text.