US 12,593,731 B2 · Packaging structure and manufacturing method thereof

Abstract

The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes: a lower package, an upper package disposed above the lower package, and a first redistribution stack layer that is disposed between the lower package and the upper package and is electrically connected to the lower package and the upper package. The lower package includes a first prefabricated redistribution stack layer and a first plastic packaging layer surrounding the first prefabricated redistribution stack layer. A minimum line width and line spacing of at least one first prefabricated conductive layer in the first prefabricated redistribution stack layer is less than a minimum line width and line spacing of at least one first conductive layer in the first redistribution stack layer.

Claims15

Dependent claims

A packaging structure, comprising:

a lower package, an upper package disposed above the lower package, and a first redistribution stack layer disposed between the lower package and the upper package, wherein the first redistribution stack layer is electrically connected to the lower package and the upper package;
wherein the lower package comprises a first prefabricated redistribution stack layer and a first plastic packaging layer surrounding the first prefabricated redistribution stack layer;
and
wherein a minimum line width and line spacing of at least one first prefabricated conductive layer in the first prefabricated redistribution stack layer is less than a minimum line width and line spacing of at least one first conductive layer in the first redistribution stack layer.

1 more element

A manufacturing method of a packaging structure, comprising steps of:

providing a first prefabricated redistribution stack layer, plastic-packaging the first prefabricated redistribution stack layer to form a first plastic packaging layer, and constituting a lower package;
forming a first redistribution stack layer on a side of the lower package, the first redistribution stack layer being electrically connected to the first prefabricated redistribution stack layer;
and
packaging an upper package above the first redistribution stack layer to obtain the packaging structure;
wherein a minimum line width and line spacing of at least one prefabricated conductive layer in the first prefabricated redistribution stack layer is less than a minimum line width and line spacing of at least one first conductive layer in the first redistribution stack layer, and the first prefabricated redistribution stack layer and the first redistribution stack layer constitute a voltage control circuit of the packaging structure.

2 more elements

Dependencies are inferred from the claim text.

Packaging structure and manufacturing method thereof

Life of this patent

Packaging structure and manufacturing method thereof

Life of this patent

Abstract

Claims15